Taping of surfacemount devices, trimming and straightening of component pins. Manufacture of carrier tapes. From Germany.

Provides integrated circuits for the electronics industry. Services include programming, marking, testing, lead scanning, taping and reeling, and materials management.

Specialize in enamelled copper wire, silicon steel lamination core and permalloy core.

Solder spheres for BGA and powders for electronics PCB.

Manufacturing ceramic packages and stripline filters in the microwave and millimeter wave (mmWave) frequencies.

Thin film multilayer coating systems and its applications.

Manufacturer of flexible copper cladded laminate and coverlay including coating, adhesiveless-FCCL, chip on film(COF), photo-imaginable-coverlay (PIC), chip on glass(COG) and tape automatic bonding (TAB) for flexible printed circuit(FPC). Includes product descriptions and photographs of flexible circuit applications.

Manufacturer of electronics terminal, lead wire and pins, used in rectifier, diode, connector, resistor, capacitor, oscillator, inductor, fuses, and pcb. From Taiwan.

Distributor of laminates, prepreg, imaging, and drilling products in the Midwest, USA.

Produces automation packaging products for the surface mount manufacturing processes.

Specializing in tinning, component lead forming, custom device packaging.

Manufacturer of bobbins, coil forms, and electronic components for the coil winding and electronics industry.

MMIC, module, and wafers produced and offered.

Supplier of float-zone silicon crystal wafers and ingots to the electronic industry.

Manufacturer of electrical copper braids, copper and aluminium laminates, and electrical conductors.