Manufacturer of specialized packaging materials for electronic components and parts.

Supplier of polished aluminum nitride substrates for miniaturization of high power microelectronic circuits and other high thermal hazard-free applications.

Tape and reel services for axial, radial, SMD and odd-form components.

Specializing in second source and customized parts for CMP, etch, CVD/PVD, and photolithography.

Manufacturers of products that are used in the storage and transportation of IC wafers. CarbonLeaf, UltraCushion and CopperLeaf wafer separators and cushions for IC container packaging.

Precious, non precious pure metal and alloys for PVD. Lids, preforms, bonding, ribbon, cald for microelectronics, semiconductor, hybrid packages.

High Precision Cleaning products and processes for all cleaning requirements in the electronic manufacturing industry with more than 20 cleaning systems worldwide.